As physical space inside electronics becomes more scarce manufacturers are looking for new ways to implement core functions in more efficient ways. A new iSIM (integrated SIM) standard is on its way as Vodafone, Qualcomm and French-based multinational company Thales have conducted tests with a proof of concept Samsung Galaxy Z Flip3 tested on Vodafone’s network.
The new iSIM standard builds upon eSIM by directly integrating the SIM technology in the device’s main chipset. For reference, eSIM required a separate chip to process data. The key feature for iSIM is that it eliminates separate dedicated space for SIM services while offering all the benefits of eSIM such as remote SIM provisioning by carriers.
The new standard will also allow a slew of devices such as wearables, laptops, tablets, VR and IoT devices to benefit from active data connections without wasting valuable space. No timeframe was provided as to when we should expect the first iSIM devices on the market.